Multilayer Blue Fast Turn Flex PCB Assembly High Density Circuit Board Manufacturing

Rigid-Flex PCB Blue Board High Density Multilayer PCB Manufacturing

♦ What is Rigid-Flex PCB?

Rigid-Flex PCB is a composite structure circuit board that combines a rigid printed circuit board (PCB) and a flexible circuit board (FPC). It is mainly composed of two parts: rigid and flexible. The rigid layer is made of traditional PCB materials (such as FR-4), providing stable electrical performance and mechanical strength; the flexible layer is made of flexible circuit materials such as polyimide or polyester, which has high bending and folding resistance; the two are connected by special adhesives or welding processes.

♦ Features of Rigid-Flex PCB

• • ​​Rigid-flexible combination, flexible design​​: The rigid part provides stable support to ensure the stability of core components (such as chips and interfaces); the flexible part can be bent and folded to adapt to complex spatial layouts, replacing traditional cables or connectors.

  • Space saving, thin and compact​​: The flexible part replaces cables and connectors, reduces the space occupied inside the device, and helps the device to be thinner (such as folding screen mobile phones and wearable devices).

  • ​High reliability and bending resistance​​: The flexible part can withstand hundreds of thousands of bends (lifespan of millions of times), adapt to dynamic scenes (such as robot joints and automotive wire control systems), and avoid the risk of fracture of traditional welding points.

♦ Applications of Rigid-Flex PCB

• • ​​Consumer electronics​​: smartphones (internal connections of folding screens), wearable devices (circuits inside smartwatch straps), tablet computers (circuit boards at hinges);
  • Industrial and medical​​: industrial sensors (detection modules that need to be bent and installed), medical implants (internal circuits of pacemakers), avionics equipment (control modules that need to resist vibration);
  • Automobile and transportation​​: battery management systems for new energy vehicles (BMS, adapted to complex battery pack layouts), on-board displays (foldable or curved screen connections), autonomous driving sensors (dynamic bending requirements);
  • ​Military and aerospace​​: satellite communication equipment (needs to be lightweight and radiation-resistant), aircraft control circuit boards (adaptable to high-vibration environments).

♦ Technical Parameters

Item	Spec
Layers	1~64
Board Thickness	0.1mm-10 mm
Material	FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc
Max Panel Size	800mm×1200mm
Min Hole Size	0.075mm
Min Line Width/Space	Standard: 3mil(0.075mm) Advance: 2mil
Board Outline Tolerance	士0.10mm
Insulation Layer Thickness	0.075mm--5.00mm
Out Layer Copper Thickness	18um--350um
Drilling Hole (Mechanical)	17um--175um
Finish Hole (Mechanical)	17um--175um
Diameter Tolerance (Mechanical)	0.05mm
Registration (Mechanical)	0.075mm
Aspect Ratio	17:01
Solder Mask Type	LPI
SMT Min. Solder Mask Width	0.075mm
Min. Solder Mask Clearance	0.05mm
Plug Hole Diameter	0.25mm--0.60mm

♦ One-Stop PCBs Solution

PCB Prototype	Felx PCB	Rigid-Flex PCB	Ceramic PCB
Heavy Copper PCB	HDI PCB	High Frequency PCB	High TG PCB

♦ Advantages of DQS Team

1. On-time Delivery:

• • Owned PCBA factories 15,000 ㎡
  • 13 fully automatic SMT lines
  • 4 DIP assembly lines

2. Quality Guaranteed:

• • IATF, ISO, IPC, UL standards
  • Online SPI, AOI, X-Ray Inspection
  • The qualified rate of products reach 99.9%

3. Premium Service:

• • 24H reply your inquiry
  • Perfect after-sales service system
  • From prototype to mass production

Multilayer fast turn flex pcb

High Density fast turn flex pcb

Multilayer flex pcb assembly

Multilayer Blue Fast Turn Flex PCB Assembly High Density Circuit Board Manufacturing Images