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ENIG FR4 PCBA BGA Assembly SMT PCB For Consumer Electronics

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ENIG FR4 PCBA BGA Assembly SMT PCB For Consumer Electronics

Certification : ISO, UL, IPC, Reach

Place of Origin : China

MOQ : 1

Price : Contact us

Payment Terms : T/T

Delivery Time : 5-30 days

Layer : 18 Layer

Material : FR4

Board Thickness : 0.2-10mm

Surface Finish : ENIG

Pin Space : 0.25mm

Application : Consumer Electronics

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Consumer Electronics BGA Assembly

♦ What Is BGA Assembly?

BGA (Ball Grid Array) assembly is a surface-mount technology used in printed circuit board (PCB) manufacturing to mount integrated circuits (ICs) with high pin counts. Instead of traditional pins, BGAs use an array of tiny solder balls underneath the package, allowing for:

- Higher density connections (more I/O in a smaller space)
- Better electrical & thermal performance (shorter signal paths, improved heat dissipation)
- Reduced risk of bent or damaged pins (since there are no leads)

♦ Key Features of Contract Manufacturing:

1. Solder Paste Application – A stencil deposits solder paste onto PCB pads.
2. BGA Placement – A pick-and-place machine positions the BGA component accurately.
3. Reflow Soldering – The PCB is heated in a reflow oven, melting the solder balls to form connections.
4. Inspection & Testing – X-ray inspection (AXI) checks for alignment and solder joint quality.

♦ Common Challenges in BGA Assembly:

- Solder joint defects (voids, bridging, cold joints)
- Difficulty in rework/repair (due to hidden solder joints)
- Thermal management (BGAs can generate heat, requiring proper PCB design)

♦ Technical Parameters

PCB Assembly Capability
Item				Normal	Special
SMT Assembly	PCB(used for SMT) specification	Length and Width( L* W)	Minimum	L≥3mm, W≥3mm	L＜2mm
		Length and Width( L* W)	Maximum	L≤800mm, W≤460mm	L ＞ 1200mm, W＞500mm
		Thickness( T)	Thinnest	0.2mm	T＜0.1mm
		Thickness( T)	Thickest	4 mm	T＞4.5mm
	SMT components specification	Outline Dimension	Min size	0201(0.6mm*0.3mm)	01005(0.3mm*0.2mm)
			Max size	200 * 125	200 * 125
			component thickness	T≤15mm	6.5mm＜T≤15mm
		QFP,SOP,SOJ (multi pins)	Min pin space	0.4mm	0.3mm≤Pitch＜0.4mm
		CSP/ BGA	Min ball space	0.5mm	0.3mm≤Pitch＜0.5mm
DIP Assembly	PCB specification	Length and Width( L* W)	Minimum	L≥50mm, W≥30mm	L＜50mm
		Length and Width( L* W)	Maximum	L≤1200mm, W≤450mm	L≥1200mm, W≥500mm
		Thickness( T)	Thinnest	0.8mm	T＜0.8mm
		Thickness( T)	Thickest	3.5mm	T＞2mm

♦ Advantages of DQS Team

On-time Delivery:

- Owned PCBA factories 15,000 ㎡
- 13 fully automatic SMT lines
- 4 DIP assembly lines

2. Quality Guaranteed:

- IATF, ISO, IPC, UL standards
- Online SPI, AOI, X-Ray Inspection
- The qualified rate of products reach 99.9%

3. Premium Service:

- 24H reply your inquiry
- Perfect after-sales service system
- From prototype to mass production

Would you like details on BGA rework or inspection techniques?

Product Tags:

ENIG BGA Assembly

FR4 BGA Assembly

ENIG pcba bga assembly smt pcb

Wholesale ENIG FR4 PCBA BGA Assembly SMT PCB For Consumer Electronics from china suppliers

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